Yield improvement with SWIR cameras

Abstract

In semiconductor chip manufacturing, an examination of failed components during operation yields valuable information about the production sites process stability and the success of quality assurance measures. The spectrum of low-level photon emissions produced by defects matches exactly the most sensitive realm of SWIR cameras fitted with thermoelectrically cooled InGaAs or HgCdTe area sensors. Such sensors are therefore well suited for failure analysis and quality assurance tasks in semiconductor manufacturing.

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